Timesys launches free webinar series on building Linux devices based on Texas Instruments OMAP-L137 and OMAP35x processors
Building an EKG Monitor or a Multimedia Server/Player could not be easier!
Pittsburgh, PA, USA – August 11, 2009 – Timesys Corporation (http://www.timesys.com), provider of LinuxLink, the first commercial software development framework for building custom embedded Linux®-based products, today announced two series of free webinars intended to guide developers through the process of building an embedded Linux-based product using Texas Instruments OMAP-L137 and OMAP35x reference platforms. The first series, which is designed around using the TI OMAP-L137 Development Kit, will focus on building an embedded media player. The second series, which uses the TI Zoom™ OMAP35x Development Kit from Logic, will introduce the use of Qt/Embedded for Linux framework, and will result in a demo-ready medical device.
Each webinar series will be delivered in three separate sessions, and both series will demonstrate the use of LinuxLink 3.0 and the award-winning Factory build system to build the embedded device. Each of the bi-monthly sessions will include a mix of presentations and hands-on exercises that addresses common embedded Linux development tasks, such as assembling a development environment, configuring and booting an initial Linux image, customizing the kernel and assembling a root filesystem.
Upon completion of the TI OMAP-L137 series, the resulting media player product will be able to serve audio files over the network and play them back using the device’s audio circuits. Upon completion of the TI OMAP35x series, the resulting product design will include a medical application with a graphical user interface displayed on the attached LCD which is controlled by a touch screen. Both finished products will be deployed in on-board flash.
“These webinars are an ideal forum for demonstrating the advanced capabilities of the LinuxLink development framework.” said Charlie Ashton, Vice President of Business Development for Timesys. “Each session will provide attendees with invaluable exposure to open source Linux development, as well as the best practices that enable engineering teams to reduce the risk and cost associated with building a Linux-based embedded product on TI processors.”
Both webinar series are free to attend. The first series begins August 13, 2009 @ 11:30 a.m. EST, and the second series begins Monday, August 31, 2009 @ 11:30 a.m. EST. Individuals can learn more about the series at the following links: http://www.timesys.com/embedded-linux/resources/webinars/linuxlink#omapl137 and/or http://www.timesys.com/embedded-linux/resources/webinars/linuxlink#medical-omap35x.
For a limited time, developers can obtain free LinuxLink access to quickly configure, build and evaluate embedded Linux on Texas Instruments OMAP-L137 or OMAP35x boards by registering at http://www.timesys.com/register.
Additional information about LinuxLink subscriptions for Texas Instruments boards can be found at http://www.timesys.com/ti.
Timesys is the provider of LinuxLink, a high-productivity software development framework for embedded Linux applications. The LinuxLink framework includes the Linux kernel, cross-toolchain, application development IDE, an award winning build system called Factory, a vast library of middleware packages, software stacks and libraries, documentation and expert technical support. LinuxLink enables development teams to consistently build and maintain a custom, open source embedded Linux platform through regularly updated Linux sources, proven middleware packages, and a scriptable GNU-based build environment. LinuxLink reduces the time, resources, risk and cost associated with building a product based on open source Linux. For more information, visit http://www.timesys.com.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures analog technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is a leader in semiconductor solutions for analog and digital embedded and applications processing.
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