Timesys Expands Relationship with Digi International, Adds Support for the ConnectCore 6 SOM to LinuxLink 5.0
Pittsburgh, Pa. – February 24, 2016 — Timesys Corporation (https://timesys.com), provider of the award-winning LinuxLink suite of embedded Linux tools, today announced the addition of Digi’s ConnectCore® 6 System-on-Module family as a fully supported platform in LinuxLink 5.0.
The recently launched LinuxLink 5.0, in addition to features such as the Factory build system, now offers a Yocto Project based set of tools, which allow users to easily build a custom Linux Board Support Package (BSP) without any prior knowledge of the Yocto technology. This greatly accelerates Linux development allowing project teams quick and easy customization of a BSP.
The Timesys tools for Yocto Project leverage Digi’s reference BSP definition and offer customers a new and powerful development option for embedded Linux product design using the Freescale/NXP i.MX6-based ConnectCore 6 module.
The LinuxLink toolset and the Linux customization is backed by Timesys’ expert Linux support, dedicated to projects and services, which can be leveraged to offload parts of a customer’s software development effort.
“We are excited to combine Digi’s embedded and wireless technology leadership with Timesys’ leading Linux software expertise and services offering. Software is a key differentiator for success in every embedded design, and the support for the new LinuxLink 5.0 release creates exceptional value for our customers,” said Mike Rohrmoser, director of product management for embedded systems at Digi International.
The LinuxLink 5.0 offering is available to customers worldwide. In addition, Timesys offers an assortment of training options, including topics such as Yocto, getting started with embedded Linux or device drivers, to enable customer engineering teams with knowledge necessary to develop and maintain Linux products.
“Quality, overall project cost, maintenance, time to market are all very important to customers designing Linux based products today,” said Maciej Halasz, vice president of technology at Timesys. “We are very proud to have been a long time leader in the embedded Linux market and with the support from the Yocto LinuxLink 5.0, we are excited to extend our assistance to customers focused on bringing to market connected products built on Digi’s secure ConnectCore 6 platform.”
For more information about Timesys’ LinuxLink 5.0 visit www.timesys.com/linuxlink.
Timesys is a pioneer and industry leader in providing embedded Linux and Android solutions. Timesys is the provider of LinuxLink, a high-productivity software development toolset that dramatically simplifies and speeds up embedded Linux application development and product lifecycle maintenance. A total solution that fits teams of all sizes and experience levels, LinuxLink includes pre-tested software, powerful suite of development tools for building feature-rich applications and debugging. LinuxLink enables developers to deliver high-quality, differentiated products based on open source Linux in a cost-effective, predictable manner. For more information, visit www.timesys.com.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of mission-critical machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services. We help our customers create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security, relentless reliability and bulletproof performance. Founded in 1985, we’ve helped our customers connect more than 100 million things, and growing. For more information, visit Digi’s website at www.digi.com, or call 877-912-3444 (U.S.) or 952-912-3444 (International).
Timesys and the Timesys logo are registered trademarks of Timesys Corporation. Linux is a registered trademark of Linus Torvalds in the United States and other countries. Yocto Project is a registered trademark of The Linux Foundation. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.